Custom Electronics Printed Circuit Board PCBA
XCEPCB manufacturing Services Including Blows:
v Fast PCB Fabrication for Samples and Mass Production
v Electronic Components Sourcing Services
v PCBA Assembly Services:SMT,DIP,BGA...
v Function Test
v Stencil,Cable and Enclosure Assembly
v Reverse engineering service
v Standard Packing and On time Delivery
Main Products Application:
v Household Appliances
v Medical Products
v Automotive Products
v Industrial Products
v Communication Products(AVL/GPS/GSM Devices)
v Consumer Electronics
PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
PCB Files →DCC →Program Organizing →Optimization →Checking
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment
What's our PCBA manufacturing productivity?
SMT Workshop (8 complete automatic SMT lines: 6 million points/day )
Solder paste printer
SMT chip mounter
AOI(Automatic Optical Inspection)
DIP Workshop (2 DIP production lines: 0.4 million points /day )
Wave Soldering oven
Manual insertion flow line
Manual Soldering (2 Hand soldering lines: 0.10 million points/day)
Manual soldering lines
Electronic soldering iron in soldering operation
Meet the various requirements of customers, we can purchase various brand IC, Resistor, Capicitor, Inductor etc.
3. PCB Assembly
SMT and Through-Hole Assembly Fine Pitch Placement
RoHS Compliance Assembly QFN and BGA Assembly
Turn-Key PCB Assembly BGA X-Ray Inspection
Prototype PCB Assembly AOI Testing
Low Volume PCB Assembly Functional Testing
SMT and DIP are integrated on the PCB board parts of the way,
the main difference is that SMT does not need to drill on the PCB,
the DIP pin in the need to insert the hole has been drilling holes.
SMT (Surface Mounted Technology)
Surface mount technology,
the main use of the placement machine is to install some small parts to the PCB board,
the production process: PCB board positioning, printing paste, placement machine placement,
back to the furnace and made of inspection. With the development of science and technology,
SMT can also be a number of large parts of the placement,
such as the motherboard can be mounted on some larger size parts.
SMT integration when the positioning and the size of parts is very sensitive,
in addition to the quality of solder paste and printing quality also play a key role.
DIP is the "plug-in", that is, in the PCB version of the insert parts,
At present the industry has manual plug-in and robot plug-in two ways to achieve,
the main production process: paste glue (to prevent tin plating should not have places),
plug-in, test, wave soldering, brush version (removed in the furnace The process of leaving the stain)
and made the test.